Performance assessment of thermoelectric self-cooling systems for electronic devices

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dc.contributor.authorDi Capua, M. H.
dc.contributor.authorJahn, Wolfram
dc.date.accessioned2025-01-20T22:20:21Z
dc.date.available2025-01-20T22:20:21Z
dc.date.issued2021
dc.description.abstractDue to the development of high-performance electronic devices, there exists a continuous need for effective and efficient cooling systems capable of removing large amounts of heat. A thermoelectric self-cooling system with forced air cooling based on a finned plate heat sink (case-a) and a water cooling based on a microchannel heat sink (case-b) is evaluated through a thermodynamic model. This article investigates the effect of the thermo-element geometry concerning its length and cross-section on the cooling capability of a self-cooling system for a wide range of heat fluxes (10 W to 200 W). Also, the effect of the efficiency related to the DC/DC converter between the thermoelectric generator and pumping devices is included in the analyses. The results show that shorter thermoelements with bigger cross-sections contribute to lower global thermal resistance and lower overheating of the electronic device. However, through the aspect ratio of the thermoelements (delta = cross-section/length), a practical limit was found defining how much shorter the thermoelement must be to satisfy a temperature constraint through the self-cooling condition for different fill factors, which corresponds to delta <= 20. Beyond this limit, the performance of the self-cooling system is affected by the low conversion of heat into electricity used to run the pumping devices. The results also demonstrate for delta = 20 and fill factor equal to 0.95, that the temperature constraint (373 K) is satisfied for a heat flux equal to 124 W (case-a) and 173 W (case-b) when the efficiency of the DC/DC converter is 10%. Instead, a DC/DC converter with the highest efficiency (95%) rises the heat flux to 161 W (case-a) and 200 W (case-b), satisfying the constraint. Finally, this article summarizes the maximum heat flux for different thermoelements aspect ratios (delta <= 20) and fill factors where the self-cooling system for both cases satisfies a temperature constraint.
dc.description.funderChilean National Research and Development Agency (ANID)
dc.fuente.origenWOS
dc.identifier.doi10.1016/j.applthermaleng.2021.117020
dc.identifier.eissn1873-5606
dc.identifier.issn1359-4311
dc.identifier.urihttps://doi.org/10.1016/j.applthermaleng.2021.117020
dc.identifier.urihttps://repositorio.uc.cl/handle/11534/94621
dc.identifier.wosidWOS:000655062500049
dc.language.isoen
dc.revistaApplied thermal engineering
dc.rightsacceso restringido
dc.subjectThermoelectric generator
dc.subjectSelf-cooling
dc.subjectHeat sink
dc.subjectElectronic device, Thermodynamic model
dc.titlePerformance assessment of thermoelectric self-cooling systems for electronic devices
dc.typeartículo
dc.volumen193
sipa.indexWOS
sipa.trazabilidadWOS;2025-01-12
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