Strain rate measurement by Electronic Speckle Pattern Interferometry

Simple item page
dc.contributor.authorGuelorget, B
dc.contributor.authorFrançois, M
dc.contributor.authorVial-Edwards, C
dc.contributor.authorMontay, G
dc.contributor.authorDaniel, L
dc.contributor.authorLu, J
dc.date.accessioned2025-01-21T01:06:26Z
dc.date.available2025-01-21T01:06:26Z
dc.date.issued2006
dc.description.abstractIn-plane Electronic Speckle Pattern Interferometry has been successfully used during tensile testing of semi-hard copper sheets in order to measure the strain rate. On one hand, heterogeneity in strain rate field has been found before the maximum of the tensile force (epsilon(t) similar or equal to 19.4 and 25.4%, respectively). Thus, a localization phenomenon occurs before the classic Considere's criterion (dF = 0) for the diffuse neck initiation. On the other hand, strain rate measurement before fracture shows the moment where one of the two slip band systems becomes predominant, then strain concentrates in a small area, the shear band. Uncertainty evaluation has been carried out, which shows a very good accuracy of the total strain and the strain rate measurements. (c) 2005 Elsevier B.V. All rights reserved.
dc.fuente.origenWOS
dc.identifier.doi10.1016/j.msea.2005.09.090
dc.identifier.issn0921-5093
dc.identifier.urihttps://doi.org/10.1016/j.msea.2005.09.090
dc.identifier.urihttps://repositorio.uc.cl/handle/11534/96157
dc.identifier.wosidWOS:000234270400031
dc.issue.numero1-2
dc.language.isoen
dc.pagina.final241
dc.pagina.inicio234
dc.revistaMaterials science and engineering a-structural materials properties microstructure and processing
dc.rightsacceso restringido
dc.subjecttensile test
dc.subjectESPI
dc.subjectstrain rate measurement
dc.subjectstrain localization
dc.subjectnecking
dc.subjectuncertainty determination
dc.titleStrain rate measurement by Electronic Speckle Pattern Interferometry
dc.typeartículo
dc.volumen415
sipa.indexWOS
sipa.trazabilidadWOS;2025-01-12
Files
Collections
Artículos de revistas