Dual TEVT education in Chile: why do companies train students?

dc.contributor.authorde Amesti, Jose
dc.contributor.authorBordon, Paola
dc.contributor.authorBolli, Thomas
dc.date.accessioned2025-01-20T20:22:08Z
dc.date.available2025-01-20T20:22:08Z
dc.date.issued2023
dc.description.abstractThis paper analyses the costs and benefits of dual training programmes for companies in Chile. The model has three main components: (1) the costs that arise during the programme (training, student labour, administrative, and educational supplies), (2) the benefits that companies receive during the programme in terms of student's productivity, and (3) the potential benefits that companies can obtain in hiring and adjustment savings if students are hired after the programme. Using an online survey, we estimate that Chilean companies that participate incur net costs of US$3,200 per student per year in training; however, most companies declared to be satisfied with dual training. We simulate two scenarios under which dual training is cost effective. Public policies to promote early adjustment such that students arrive at companies better prepared and can allocate more time to productive tasks should be considered to decrease the net cost of training.
dc.fuente.origenWOS
dc.identifier.doi10.1080/13636820.2021.1995468
dc.identifier.eissn1747-5090
dc.identifier.issn1363-6820
dc.identifier.urihttps://doi.org/10.1080/13636820.2021.1995468
dc.identifier.urihttps://repositorio.uc.cl/handle/11534/92662
dc.identifier.wosidWOS:000710037400001
dc.issue.numero5
dc.language.isoen
dc.pagina.final1032
dc.pagina.inicio1013
dc.revistaJournal of vocational education and training
dc.rightsacceso restringido
dc.subjectVocational education & training
dc.subjectworkplace learning
dc.subjectvet and the labour market
dc.subject.ods04 Quality Education
dc.subject.ods10 Reduced Inequality
dc.subject.odspa04 Educación de calidad
dc.subject.odspa10 Reducción de las desigualdades
dc.titleDual TEVT education in Chile: why do companies train students?
dc.typeartículo
dc.volumen75
sipa.indexWOS
sipa.trazabilidadWOS;2025-01-12
Files